This project entails changing the entire assembly material set from those materials which require aqueous cleaning after processing to those which do not require any cleaning at all.
The most important change is in the soldering flux/solder paste chemistry which allows the inert materials to remain on the printed circuit boards after use. The flux/solder paste is available from several vendors including Kester, Alpha, Multicore, Lonco and others.
The project reduces both water use and energy consumption. IBM will reduce water use and wastewater treatment by 20,000,000 gallons a year. Natural gas use was reduced by 29,000,000 pounds per year. Electrical use is reduced by 6,000,000 KWH per year.
Details of Reductions
Additional Information :
The total cost saving for this project amount to approximately $2,000,000 a year. The project costs were about $750,000.