IBM

Year Submitted: 2003

Process: Circuit Board Soldering

Industry: Electronics Manufacturing

Wastes Reduced: Solder

Equipment: new flux/solder

Location: Austin TX

No. of employees: 7000

Contact: Robert Tassan

Phone: (512) 838-6936

Description:

This project entails changing the entire assembly material set from those materials which require aqueous cleaning after processing to those which do not require any cleaning at all.
This process includes the elimination of repair aqueous cleaning which is fully implemented, and all post mass production cleaning which is 30% complete.

P2 Application:

The most important change is in the soldering flux/solder paste chemistry which allows the inert materials to remain on the printed circuit boards after use. The flux/solder paste is available from several vendors including Kester, Alpha, Multicore, Lonco and others.

Environmental Benefits:

The project reduces both water use and energy consumption. IBM will reduce water use and wastewater treatment by 20,000,000 gallons a year. Natural gas use was reduced by 29,000,000 pounds per year. Electrical use is reduced by 6,000,000 KWH per year.

Details of Reductions

Additional Information :

The total cost saving for this project amount to approximately $2,000,000 a year. The project costs were about $750,000.

Source: TCEQ